Industry-leading high-speed and high-precision placement machines, paired with fully automated board loaders, solder paste printers and reflow ovens, deliver efficient and stable assembly.
Stable placement of 0201-class precision components and BGA, QFP and other package types, with SPI solder paste inspection and AOI optical inspection ensuring soldering quality.
All production processes are integrated with the MES manufacturing execution system, providing full-chain visualized management of material traceability, process control and quality data.
Integrated solutions of component sourcing + PCB fabrication + SMT assembly + finished product testing, shortening R&D cycles and reducing overall procurement costs.

Hotline
13983899892
Working Hours
Mon - Fri
Office Tel
0755-23606348